- Participants explored the feasibility of low-cost, open-source glass 3-D printing, comparing MIT’s high-resolution fused-silica approach (Nature 2017) with earlier art-scale extrusion and solar-fresnel “sand-to-glass” demos, and debated whether commodity FDM or laser-sintering rigs could reach glass-melt temperatures with tungsten nozzles and argon atmospheres.  
- Infrared absorption properties of silica were examined: glass is largely transparent to near-IR but strongly absorbs beyond ~5 µm, suggesting that a 10 µm CO₂ laser could sinter glass powder without exotic dopants.  
- Practical feedstock options were proposed—recycled glass beads, fumed silica, and even ball-milled household glass—to avoid high-purity commercial powders, with caveats about devitrification and long-term chemical stability.  
- nmz787 outlined a PCI (not PCIe) bus-sniffer project using an FPGA card to reverse-engineer the scan-generator card in a Focused Ion Beam (FIB) workstation running Windows XP, motivated by the obsolescence of commercial Windows 3.1-era sniffers.  
- L29Ah noted that FT2232H-based USB2 logic analyzers are bandwidth-limited and advocated migrating to USB3 solutions for future reverse-engineering tasks.  
- A hardware-security workshop link (securinghardware.com) was shared, demonstrating how an FTDI chip can be weaponized to bypass Raspberry Pi login via JTAG.  
- kanzure circulated a Project-Zero advisory on a Windows kernel cng.sys buffer overflow (IOCTL 0x390400) and a proposal for tamper-resistant entropy generation using Verifiable Delay Functions (VDFs) to reseed on-chip CSPRNGs against malicious hardware.  
- The diyhpluswiki was updated with transcripts of John Newbery’s 2020 talk on expressive Bitcoin scripting and smart-contract techniques.