• Earth-Trojan asteroid 2020 XL5 was dismissed as a mining target because its 10.3 km/s Δv is twice that of the best near-Earth objects; Asterank data show Ryugu, 1989 ML, Nereus, Bennu and Didymos/Dimorphos are far more accessible for early resource extraction.

• Stainless steel from the 23-Zg metallic asteroid 16 Psyche was identified as the highest-value bulk commodity, while precious-group metals offer high unit value but small mass; participants argued that NEO mining beats main-belt mining because the latter requires ~10 km/s Δv and multi-year transfer windows.

• A “feathered-reentry” concept—large, low-mass conical heat shields or plasma-magnet sails to aerobrake asteroid cargo—was proposed as a way to deliver metals to Earth without ablative heat shields, highlighting the exponential cost penalty of high-Δv missions (10 km/s can demand 20–30× launch mass).

• A lunar equatorial power loop—an aluminum conductor ring fed by polar solar plants—was sketched to supply continuous electricity to Moon bases, mitigating the 14-day lunar night and the gravity-well penalty compared with free-space asteroids that already offer 24/7 solar power and vacuum processing.

• Long-term vision converged on self-replicating machines converting asteroids into “computronium” for a Kardashev Type-II civilization, contingent on open IP and freedom from geopolitical conflict to enable megascale engineering.

• nmz787_ is prototyping an open “science ranch” clean-room roadmap that starts with solvents and evolves to CMOS-compatible nano/microfluidic MEMS, targeting wafer-scale sub-20 nm nanopore arrays with embedded electrodes bonded to an Analog Devices AD5933 impedance analyzer; equipment includes ALD, DRIE and FIB already demonstrated on spores and BMP patterns (gallery at diyhpl.us/~nmz787/pdf/smi3200/pics.html).

• A SAT-solver-driven 3-D autorouter was built to place and route components in volumetric space; code and DIMACS examples are on GitHub (nmz787/sat_solver_examples) and were inspired by academic constraint-routing literature.

• Community consensus is that true 3-D integration—embedding ICs and 3-D wiring in resin blocks—could surpass 2-D PCB density; Georgia Tech’s Tentzeris group and Nano-Dimension’s inkjet “AME” technology (silver ink + pick-and-place in one SLA pass) were cited as state-of-the-art, with open-source inkjet printheads and hybrid SLA/PNP systems judged feasible for hobbyist replication.