• Discussion of 3-D printing low-power electronics with embedded heat-dissipation: participants weighed using high-thermal-conductivity substrates (BeO, diamond-filled resin) versus micro-fluidic cooling channels, and noted that dense cordwood-style layouts pre-date modern ICs.

• Inkjet-based PCB fabrication was explored in depth: the group compared piezoelectric vs. thermal printheads, drop volumes (consumer ≈ 3–4 pL, industrial ≈ 40 pL), and the need for UV-curable and silver-nanoparticle inks; Xaar heads were initially ruled out for “no conductive inks” but later reconsidered after noting only “approved inks” are specified.

• Reverse-engineering consumer Epson piezo heads (Stylus, Workforce, Artisan series) was highlighted as a low-cost path; MIT and Hackaday links were shared, showing documented protocols and drive electronics, while Brother heads were deemed harder to source independently.

• Throughput estimates: a 4.8 µL/s Epson head would take ~1 hour to print a 20 mL PCB—comparable to hobby 3-D printing times—whereas industrial heads at 4 kHz would be faster but cost thousands of dollars per unit.

• nmz787_ outlined a MEMS nanofluidic sensor project using ALD for 20 nm electrodes, DRIE for fluidic vias, and e-beam lithography for fine features, aiming for proof-of-concept devices rather than full wafer-scale production.

• Historical analogy: the Meiji Restoration (post-Perry Black Ships) was debated as a model for rapid societal transformation, with life expectancy rising from ~36 to 84 years, prompting reflection on how a “posthuman transition” might similarly compress decades of change into months or years.

• Open-source geometry tools shared: kanzure posted the libfive F-rep kernel and cq_gears library for programmatic CAD, underscoring the channel’s ongoing interest in reproducible, code-driven hardware design.