- ASML’s monopoly on extreme-ultraviolet (EUV) lithography was debated: while ASML is the sole supplier of sub-10 nm EUV tools, participants noted that 45–180 nm nodes remain viable for “advanced” chips and that immersion lithography competitors (Nikon, SMEE) may catch up by 2025.  
- Concern was raised that the entire semiconductor roadmap depends on a single company whose critical knowledge is not redundantly archived or shared.  
- Forecasts for 2050 semiconductor fabrication converged on atomically-precise manufacturing: carbon-nanotube-based or other 3-D atomic-scale processes were judged more plausible than full Drexlerian molecular nanotechnology, driven by sustained industry investment rather than the stalled nanotech funding of past decades.  
- Reversible computing was discussed as a niche technology (analogous to quantum computing) unlikely to replace CMOS for general use, despite claims that power-density limits could force adoption in the 2040s.  
- Hydrogen-passivation lithography was proposed as a near-term route to scalable 2-D atomically-precise chips with ~5 years of focused investment, but extending this to 3-D atomic assembly remains an unsolved leap.  
- Emerging integration efforts combine directed-self-assembly (DSA) etch resists, carbon nanotubes, and 2-D materials; continued consumer device upgrades were identified as the economic driver needed to sustain these advances.