Microlithography Materials and Processes

Microelectronic Engineering Program
Microlithography Materials and Processes
0305-676/721 Laboratory

2122 Schedule Laboratory Data Lab Data from 2122		EMCR 676/721 Labs: Prolith Startup Server Access_to_KGCOE-kif PROLITH by KLA-Tencor UserResistA UserDefinedA Lab – Nanoimprint Lithography Imprint Intro, Procedure 12142007 Glenn presentation from 2007 UGSS Lab - Absorbance in Photoresist Absorbance 20111 Lab - Development Rate Measurement DRM Lab manual 20111.pdf DRM Lab manual 20111 Lab - Swing Curves Swing Curve 20121 Reference paper 1 Reference paper 2 It is highly recommended that simulations are carried out before lab. Lab - Multi-layer or Double Patterning It is highly recommended that simulations are carried out before lab. Dale Ewbank 475.4941 Office ENG-2551 dale.ewbank@rit.edu 475.4453 Grad Office 09/1360 xxx@rit.edu
Lab Notebooks	Purchase Notebook Requirements Reference Paper Company Guideline Samples
Lab Reports	Report Guidelines SPIE Information link for SPIE templates SPIE Sample Manuscript Full SPIE Sample Manuscript Format IEEE Guidelines
Photoresists and Materials	S1813 datasheet HPR 504 datasheet HPR500 for g-line AZ 5214 E OiR 620 datasheet Arch 8250 datasheet A Arch 8250 datasheet B DUV Product Overview Shipley UVIII datasheet Irgacure 651 Darocur 1173 Photoinitiators for UV curing
ARC's	Understanding ARC Understanding BARC ARC Product Overview DUV ARC Overview DUV 32 ARC datasheet XL ARC Presentation XL ARC datasheet ARC i-CON datasheet ARC29A-8 datasheet
Solvents	PGMEA
MSDS	Brewer DUV 32 ARC Brewer XLT ARC ARC i-CON-16 Shipley 812 S1813 Photoresist HPR 504 OiR 620-10 Arch 8250-10 Shipley UVIII TSMR-iN008 Butyl acrylate Isobornyl acrylate Ethylene glycol diacrylate Irgacure 651 Darocur 1173 PGMEA

Selected Papers Optical Lithography - F.H. Dill (1975) In-Situ Measurement of Dielectric Thickness During Etching or Developing Processes - K.L. Konnerth, F.H. Dill (1975) Characterization of Positive Photoresist - F.H. Dill, W.P. Hornberger, P.S. Hauge, J.M. Shaw (1975) Modeling Projection Printing of Positive Photoresist - F.H. Dill, A.R. Neureuther, J.A. Tuttle, E.J. Walker (1975) Prolith: A Comprehensive Optical Lithography Model - Chris A. Mack (1985) Lithographic Performance of Isomeric Hydroxystyrene Polymers - R.R. Dammel, M.D. Rahman, P.H. Lu, A. Canize, V. Elango (1994) A Membrane Model for Positive Photoresist Development - R.A. Arcus (1986) Measurement of Positive Photoresist Parameters A, B, and C - Chris A. Mack (Unpublished) DRM notes http://people.rit.edu/lffeee/Lec_drm.pdf Investigation of Residual Stress on SU-8 Films: A Design of Experiments Approach,presentation and papers by Eyup Cinar, 2012, and Ryan M. Bowen, 2012.		Airborne Chemical Contamination of a Chemically Amplified Resist - S.A. Macdonald, N.J. Clecak, C.D. Snyder, H.R. Wendt, C.G. Wilson, C.J. Knors, N.B. Deyoe, J.G. Maltbes, J.R. Morrow, A.E. McGuire, S.J. Holmes (1991) Preliminary Lithographic Characteristics of an All-organic Chemically Amplified Resist Formulation for Single Layer Deep UV Lithography - O. Nalamasu, E. Reichmanis, M. Cheng, V. Pol, J.M. Kometani, F.M. Houlihan, T.X. Neenan, M.P. Bohrer, D.A. Mixon, L.F. Thompson (1991) Quantitation of Airborne Chemical Contamination of Chemically Amplified Resists Using Radio Chemical Analysis - W.D. Hinsberg, S.A. Macdonald, N.J. Clecak, C.D. Snyder (1992) Critical Process Parameters of Acetal Based Deep UV Photoresist - H. Roschert, K.J. Pryzbilla, W. Spiess, H. Wengenroth, G. Pawlowski (1992) A Review of Material Issues in Immersion Lithography - E. C. Piscani (2005)